A Brief Review of Heat Sink, Heat Pipe, and Vapor Chamber as a Key Function of Thermal Solution for Electronic Devices


  •   Mohamed Elnaggar

  •   Mohammed Abu Hatab

  •   Ezzaldeen Edwan


Electronics industry requires efficient design that can handle fast mathematical operations to compensate for the growing development and demand for processing power. These days, there are numerous equipment or parts inside machines called heating elements particularly with electrical or electronic devices and they should be cooled during the working process. However, with respect to their size, manufacturers are minifying day by day to satisfy requirements of users but the power should be maintained. Hence, elements withstand a high amount of heat and high heat flux (transition/mutability) is being generated during the working process. The main contribution of this study is to investigate thermal solutions using four cooling tools and to compare to each other and consider thermal design guidelines and factors as well. Furthermore, we review the appropriate thermal solutions for the produced heat from the electronic equipment and we present the effective and suitable tools which used to dissipate this heat. A heat sink, heat pipe, and vapor chamber are reviewed and compared depending on the previous studies that have implemented them.

Keywords: Thermal solution; Vapor chamber; Heat sink; Heat pipe; electronic devices


G. Ledezma and A. Bejan, "Heat sinks with sloped plate fins in natural and forced convection," International Journal of Heat and Mass Transfer, doi: 10.1016/0017-9310(95)00297-9 vol. 39, no. 9, pp. 1773-1783, 1996.

G. Huminic, A. Huminic, I. Morjan, and F. Dumitrache, "Experimental study of the thermal performance of thermosyphon heat pipe using iron oxide nanoparticles," International Journal of Heat and Mass Transfer, doi: 10.1016/j.ijheatmasstransfer.2010.09.005 vol. 54, no. 1-3, pp. 656-661, 2011.

A. Faghri, Heat Pipe Science and Technology. Taylor & Francis Group, 1995.

G. P. Peterson, An Introduction to heat pipes: Modeling, Testing, and Applications. New York: John Wiley & Sons, INC, 1994.

P. D. Dunn and D. A. Reay, Heat Pipes, fourth ed. Oxford, UK: Pergamon Press, 1982.

M. H. Elnaggar and E. Edwan, "Heat Pipes for Computer Cooling Applications," in Electronics Cooling: InTech, 2016.

J. C. Wang, "Novel Thermal Resistance Network Analysis of Heat Sink with Embedded Heat Pipes," Jordan Journal of Mechanical and Industrial Engineering, vol. 2, no. 1, pp. 23-30, 2008.

M. H. A. Elnaggar, M. Z. Abdullah, and M. Abdul Mujeebu, "Experimental analysis and FEM simulation of finned U-shape multi heat pipe for desktop PC cooling," Energy Conversion and Management, vol. 52, no. 8–9, pp. 2937-2944, 2011.

A. A. Hussien, M. Z. Abdullah, and A.-N. Moh’d A, "Single-phase heat transfer enhancement in micro/minichannels using nanofluids: theory and applications," Applied energy, vol. 164, pp. 733-755, 2016.

S.-C. Wong, K.-C. Hsieh, J.-D. Wu, and W.-L. Han, "A novel vapor chamber and its performance," International Journal of Heat and Mass Transfer, vol. 53, no. 11-12, pp. 2377-2384, 2010.

S.-C. Wong, S.-F. Huang, and K.-C. Hsieh, "Performance tests on a novel vapor chamber," Applied Thermal Engineering, vol. 31, no. 10, pp. 1757-1762, 2011.

Y.-T. Chen, S.-W. Kang, Y.-H. Hung, C.-H. Huang, and K.-C. Chien, "Feasibility study of an aluminum vapor chamber with radial grooved and sintered powders wick structures," Applied Thermal Engineering, vol. 51, no. 1-2, pp. 864-870, 2013.

X. C. Tong, Advanced materials for thermal management of electronic packaging. Springer Science & Business Media, 2011.

M. Mochizuki, T. Nguyen, K. Mashiko, Y. Saito, T. Nguyen, and V. Wuttijumnong, "A Review of Heat Pipe Application Including New Opportunities," Frontiers in Heat Pipes, vol. 2, no. 1, pp. 1-15, 2011.

B. C. Heat Pipes and Vapor Chambers – What’s the Difference? Available: https://celsiainc.com/blog-heat-pipes-and-vapor-chambers-whats-the-difference/.

G. Meyer. (2017). What’s the Difference Between Heat Pipes and Vapor Chambers Available: http://www.electronicdesign.com/components/what-s-difference-between-heat-pipes-and-vapor-chambers.

W. G. (2011). Why eTray laptop trays don’t have fans. Available: http://www.etray.co.uk/etraynews/index.php/why-etrays-dont-have-fans]/.


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How to Cite
Elnaggar, M., Hatab, M.A. and Edwan, E. 2020. A Brief Review of Heat Sink, Heat Pipe, and Vapor Chamber as a Key Function of Thermal Solution for Electronic Devices. European Journal of Engineering and Technology Research. 5, 11 (Nov. 2020), 1297-1300. DOI:https://doi.org/10.24018/ejers.2020.5.11.1596.